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1

CMOS: compatible wafer bonding for MEMS and wafer-level 3D integration

Viorel Dragoi, Eric Pabo, Jürgen Burggraf, Gerald Mittendorfer

Journal:

Microsystem Technologies

Year:

2012

Language:

english

File:

PDF, 728 KB

english, 2012

2

Wafer Bonding for Backside Illuminated CMOS Image Sensors Fabrication

Dragoi, Viorel, Mittendorfer, Gerald, Filbert, Alexander, Wimplinger, Markus

Journal:

MRS Proceedings

Year:

2010

Language:

english

File:

PDF, 1.50 MB

english, 2010

3

Graphic interface for numerical commands on the USB port of PC compatible computers

Popa, Elena, Popa, Viorel, Oancea, G., Drăgoi, M.V.

Journal:

MATEC Web of Conferences

Year:

2017

Language:

english

File:

PDF, 1.11 MB

english, 2017

4

Wafer-level plasma activated bonding: new technology for MEMS fabrication

Viorel Dragoi, Gerald Mittendorfer, Christine Thanner, Paul Lindner

Journal:

Microsystem Technologies

Year:

2008

Language:

english

File:

PDF, 298 KB

english, 2008

5

Adhesive wafer bonding with photosensitive polymers for MEMS fabrication

Erkan Cakmak, Viorel Dragoi, Elliott Capsuto, Craig McEwen, Eric Pabo

Journal:

Microsystem Technologies

Year:

2010

Language:

english

File:

PDF, 385 KB

english, 2010

6

ECS Transactions [ECS China Semiconductor Technology International Conference 2012 (CSTIC 2012) - Shanghai, China (March 18 - March 19, 2012)] - Wafer Bonding for Backside Illuminated Image Sensors

Matthias, Thorsten, Uhrmann, Thomas, Dragoi, Viorel, Wagenleitner, Thomas, Lindner, Paul

Year:

2012

Language:

english

File:

PDF, 696 KB

english, 2012

7

ECS Transactions [ECS 218th ECS Meeting - Las Vegas, NV (October 10 - October 15, 2010)] - Metal Thermocompression Wafer Bonding for 3D Integration and MEMS Applications

Dragoi, Viorel, Mittendorfer, Gerald, Burggraf, Jürgen, Wimplinger, Markus

Year:

2010

Language:

english

File:

PDF, 851 KB

english, 2010

8

Handbook of Silicon Based MEMS Materials and Technologies || Wafer-Bonding Equipment

Year:

2015

Language:

english

File:

PDF, 1.17 MB

english, 2015

9

Direct Wafer Bonding of GaN for Power Devices Applications

Dragoi, Viorel, Razek, Nasser, Guiot, Eric, Caulmilone, Raphael, Liao, Michael, Wang, Yekan Steven, Goorsky, Mark S., Yates, Luke, Graham, Samuel

Journal:

ECS Transactions

Year:

2018

Language:

english

File:

PDF, 529 KB

english, 2018

10

Improving communication among stakeholders through ex-post transactional analysis — case study on Romanian forestry

Marian Dragoi, Bogdan Popa, Viorel Blujdea

Journal:

Forest Policy and Economics

Year:

2011

Language:

english

File:

PDF, 360 KB

english, 2011

11

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - CMOS image sensor wafer-level packaging

Matthias, Thorsten, Kreindl, Gerald, Dragoi, Viorel, Wimplinger, Markus, Lindner, Paul

Year:

2011

Language:

english

File:

PDF, 2.79 MB

english, 2011

12

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Versatile thin wafer stacking technology for monolithic integration of temporary bonded thin wafers

Uhrmann, Thomas, Burggraf, Jurgen, Bravin, Julian, Dragoi, Viorel, Wimplinger, Markus, Matthias, Thorsten, Lindner, Paul

Year:

2014

Language:

english

File:

PDF, 2.15 MB

english, 2014

13

[ECS 210th ECS Meeting - Cancun, Mexico (October 29-November 3, 2006)] ECS Transactions - Plasma Activated Wafer Bonding as an Alternative to Standard Wafer Bonding Processes

Dragoi, Viorel, Matthias, Thorsten, Mittendorfer, Gerald, Lindner, Paul

Year:

2006

Language:

english

File:

PDF, 31 KB

english, 2006

14

[IEEE 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011) - Singapore, Singapore (2011.12.7-2011.12.9)] 2011 IEEE 13th Electronics Packaging Technology Conference - Low temperature packaging of BioMEMS and Lab-on-chip devices

Matthias, Thorsten, Miller, Ron, Thanner, Christine, Burgstaller, Daniel, Kreindl, Gerald, Dragoi, Viorel, Kettner, Paul, Lindner, Paul

Year:

2011

Language:

english

File:

PDF, 1.03 MB

english, 2011

15

[ECS 214th ECS Meeting - Honolulu, HI (October 12 - October 17, 2008)] ECS Transactions - Plasma Activation for Low Temperature Wafer Bonding

Plach, Thomas, Dragoi, Viorel, Murauer, Franz, Hingerl, Kurt

Year:

2008

Language:

english

File:

PDF, 1.07 MB

english, 2008

16

Metal Wafer Bonding for MEMS Applications

Dragoi, Viorel, Mittendorfer, Gerald, Murauer, Franz, Cakmak, Erkan, Pabo, Eric

Journal:

MRS Proceedings

Year:

2008

Language:

english

File:

PDF, 147 KB

english, 2008

17

Aligned Low Temperature Wafer Bonding for MEMS Manufacturing: Challenges and Promises

Dragoi, Viorel, Matthias, Thorsten, Mittendorfer, Gerald, Lindner, Paul

Journal:

MRS Proceedings

Year:

2007

Language:

english

File:

PDF, 463 KB

english, 2007

18

Aluminum Thermo Compression Bonding Characterization

Cakmak, Erkan, Dragoi, Viorel, Pabo, Eric, Matthias, Thorsten, Alford, T. L.

Journal:

MRS Proceedings

Year:

2009

Language:

english

File:

PDF, 269 KB

english, 2009

19

[ECS 210th ECS Meeting - Cancun, Mexico (October 29-November 3, 2006)] ECS Transactions - Adhesive Wafer Bonding with SU-8 Intermediate Layers for Microfluidic Applications

Dragoi, Viorel, Mittendorfer, Gerald, Thanner, Christine, Matthias, Thorsten, Glinsner, Thomas, Lindner, Paul

Year:

2006

Language:

english

File:

PDF, 679 KB

english, 2006

20

[ECS 213th ECS Meeting - Phoenix, AZ (May 18 - May 23, 2008)] ECS Transactions - Wafer Bonding of Plasma Activated Surfaces

Plach, Thomas, Dragoi, Viorel, Mittendorfer, Gerald, Wimplinger, Markus, Hingerl, Kurt

Year:

2008

Language:

english

File:

PDF, 614 KB

english, 2008

21

ECS Transactions [ECS 218th ECS Meeting - Las Vegas, NV (October 10 - October 15, 2010)] - Novel Photolithography Yield-Enhancement Technique: Megasonic-Enhanced Development

Dragoi, Viorel, Bartel, Johanna, Dussault, Don

Year:

2010

Language:

english

File:

PDF, 757 KB

english, 2010

22

Effect of Process Variables on Glass Frit Wafer Bonding in MEMS Wafer Level Packaging

Sridharan, Sid, Henry, Jim, Maloney, John, Gardner, Bob, Mason, Keith, Dragoi, Viorel, Burggraf, Jurgen, Pabo, Eric, Cakmak, Erkan

Journal:

MRS Proceedings

Year:

2008

Language:

english

File:

PDF, 3.81 MB

english, 2008

23

[ECS 214th ECS Meeting - Honolulu, HI (October 12 - October 17, 2008)] ECS Transactions - Microring Resonators Fabrication by BCB Adhesive Wafer Bonding

Dragoi, Viorel, Alexe, Marin, Hamacher, Michael, Heidrich, Helmut

Year:

2008

Language:

english

File:

PDF, 585 KB

english, 2008

24

Converting Point Cloud to Revolved Solids

Drăgoi, Mircea Viorel, Navalušić, Slobodan

Journal:

Applied Mechanics and Materials

Year:

2013

Language:

english

File:

PDF, 783 KB

english, 2013

25

ECS Transactions [ECS 218th ECS Meeting - Las Vegas, NV (October 10 - October 15, 2010)] - Innovative Megasonic Cleaning Technology Evaluated Through Direct Wafer Bonding

Fournel, Frank, Bally, Laurent, Dussault, Don, Dragoi, Viorel

Year:

2010

Language:

english

File:

PDF, 667 KB

english, 2010

26

[ECS 210th ECS Meeting - Cancun, Mexico (October 29-November 3, 2006)] ECS Transactions - Plasma Activated Wafer Bonding of Silicon: In Situ and Ex Situ Processes

Dragoi, Viorel, Lindner, Paul

Year:

2006

Language:

english

File:

PDF, 501 KB

english, 2006

27

ECS Transactions [ECS 218th ECS Meeting - Las Vegas, NV (October 10 - October 15, 2010)] - Wafer Bonding Process Selection

Dragoi, Viorel, Pabo, Eric

Year:

2010

Language:

english

File:

PDF, 297 KB

english, 2010

28

Smart Adaptive CNC Machining - State of the Art

Vasiloni, Anton Mircea, Dragoi, Mircea Viorel

Journal:

Applied Mechanics and Materials

Year:

2014

Language:

english

File:

PDF, 775 KB

english, 2014

29

[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Influencing factors in high precision fusion wafer bonding for monolithic integration

Uhrmann, Thomas, Kurz, Florian, Plach, Thomas, Wagenleitner, Thomas, Dragoi, Viorel, Wimplinger, Markus, Lindner, Paul

Year:

2015

Language:

english

File:

PDF, 817 KB

english, 2015

30

SPIE Proceedings [SPIE SPIE Europe Microtechnologies for the New Millennium - Dresden, Germany (Monday 4 May 2009)] Smart Sensors, Actuators, and MEMS IV - Adhesive wafer bonding using photosensitive polymer layers

Dragoi, Viorel, Schmid, Ulrich, Cakmak, Erkan, Capsuto, Elliott, McEwen, Craig, Pabo, Eric

Year:

2009

Language:

english

File:

PDF, 1.03 MB

english, 2009

31

Si/GaAs heterostructures fabricated by direct wafer bonding

Dragoi, Viorel, Alexe, Marin, Reiche, Manfred, Radu, Ionut, Thallner, Erich, Schaefer, Christian, Lindner, Paul

Journal:

MRS Proceedings

Year:

2001

Language:

english

File:

PDF, 705 KB

english, 2001

32

SPIE Proceedings [SPIE Integrated Optoelectronic Devices 2006 - San Jose, CA (Saturday 21 January 2006)] Integrated Optics: Devices, Materials, and Technologies X - From magic to technology: materials integration by wafer bonding

Dragoi, Viorel, Sidorin, Yakov, Waechter, Christoph A.

Year:

2006

Language:

english

File:

PDF, 684 KB

english, 2006

33

SPIE Proceedings [SPIE Microtechnologies for the New Millennium 2003 - Maspalomas, Gran Canaria, Canary Islands, Spain (Monday 19 May 2003)] Smart Sensors, Actuators, and MEMS - Adhesive wafer bonding for MEMS applications

Dragoi, Viorel, Glinsner, Thomas, Mittendorfer, Gerald, Wieder, Bernhard, Lindner, Paul, Chiao, Jung-Chih, Varadan, Vijay K., Can, Carles

Year:

2003

Language:

english

File:

PDF, 1.04 MB

english, 2003

34

Aligning Tools on a Press by Means of 3D Scanning

Drăgoi, Mircea Viorel, Manolescu, Alexandru, Vasiloni, Mircea Anton

Journal:

Applied Mechanics and Materials

Year:

2016

Language:

english

File:

PDF, 649 KB

english, 2016

35

Surface pretreated low-temperature aluminum–aluminum wafer bonding

Hinterreiter, Andreas P., Rebhan, Bernhard, Flötgen, Christoph, Dragoi, Viorel, Hingerl, Kurt

Journal:

Microsystem Technologies

Year:

2017

Language:

english

File:

PDF, 2.01 MB

english, 2017

36

Designing parts for a robust behaviour against vibrations. A new concept

Corciovă, Florin, Drăgoi, Mircea Viorel, Oancea, G., Drăgoi, M.V.

Journal:

MATEC Web of Conferences

Year:

2017

Language:

english

File:

PDF, 1.99 MB

english, 2017

37

Handbook of Silicon Based MEMS Materials and Technologies || Wafer-Bonding Equipment

Year:

2010

Language:

english

File:

PDF, 1.52 MB

english, 2010

38

Si-Ge Heterostructures Fabricated by Room Temperature Wafer Bonding

Razek, Nasser, Dragoi, Viorel, Jung, Arik, von Känel, Hans

Journal:

ECS Transactions

Year:

2018

Language:

english

File:

PDF, 448 KB

english, 2018

39

(Invited) High Accuracy Aligned Wafer Bonding for Wafer-Level Integration

Plach, Thomas, Rebhan, Bernhard, Dragoi, Viorel, Wagenleitner, Thomas, Wimplinger, Markus, Lindner, Paul

Journal:

ECS Transactions

Year:

2018

Language:

english

File:

PDF, 1.85 MB

english, 2018

40

Simulation of random events for adaptive control systems calibration

Drăgoi, Mircea Viorel, Vasiloni, Mircea Anton, Bondrea, I., Simion, C., Inţă, M.

Journal:

MATEC Web of Conferences

Year:

2017

Language:

english

File:

PDF, 186 KB

english, 2017

41

Virtual Instrumentation for Adaptive Control of Cutting Processes

Vasiloni, Anton Mircea, Dragoi, Mircea Viorel

Journal:

Applied Mechanics and Materials

Year:

2015

File:

PDF, 1.28 MB

2015